JPH03106235U - - Google Patents
Info
- Publication number
- JPH03106235U JPH03106235U JP1428290U JP1428290U JPH03106235U JP H03106235 U JPH03106235 U JP H03106235U JP 1428290 U JP1428290 U JP 1428290U JP 1428290 U JP1428290 U JP 1428290U JP H03106235 U JPH03106235 U JP H03106235U
- Authority
- JP
- Japan
- Prior art keywords
- island
- hanging pin
- lead frame
- pin
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims 1
- 238000004080 punching Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000725 suspension Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
Landscapes
- Wire Processing (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1428290U JPH03106235U (en]) | 1990-02-16 | 1990-02-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1428290U JPH03106235U (en]) | 1990-02-16 | 1990-02-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03106235U true JPH03106235U (en]) | 1991-11-01 |
Family
ID=31517651
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1428290U Pending JPH03106235U (en]) | 1990-02-16 | 1990-02-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03106235U (en]) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4854869A (en]) * | 1971-11-09 | 1973-08-01 | ||
JPH01293928A (ja) * | 1988-05-20 | 1989-11-27 | Mitsubishi Electric Corp | 半導体装置用リード加工金型 |
-
1990
- 1990-02-16 JP JP1428290U patent/JPH03106235U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4854869A (en]) * | 1971-11-09 | 1973-08-01 | ||
JPH01293928A (ja) * | 1988-05-20 | 1989-11-27 | Mitsubishi Electric Corp | 半導体装置用リード加工金型 |